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NdFeB SmCo Semi Automatic Square Rod Forming Milling Rounding Grinding Machine, NdFeB Square Forming Grinding Machine, Square Bar Tumbling Milling Machine

Supplier Guangzhou Minder-Hightech co.,Ltd
Price $2300.00 / Set
Availability In Stock
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Subtotal: $2300

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Model NO.
rounding grinding machine
Working Style
High-speed universal
Variable Speed
With Variable Speed
Maximum Processing Size (mm)
Φ3square Blank, Φ6 Cylindrical Blank
Minimum Processing Size (mm)
Φ0.8
Grinding Length Range (mm)
10-50
Grinding Speed (Min)
Continuous Feeding 600-800mm
Grinding Accuracy (mm)
Rough Grinding Non-Roundness ±0.04
Guide Wheel Table Lateral Stroke (mm)
80
up and Down Stroke of Guide Plate (mm)
25
Main Motor
1.5kw ×1460r/Min
Secondary Motor
1.1kw × (0-1200r/Min)
Weight
400kg
Transport Package
Standard Export Wooden Case Packing
Specification
890  *850  *1300mm
Origin
China
Production Capacity
100 Pieces/ Month
Type:
Die Grinder
Power Source:
Electricity
Object:
Milling Cutter
Application:
Construction
Disc(Wheel) Type:
Grinding Disc
Material:
Diamond Grinding Wheel
Product Description
The square grinding machine is a special equipment for grinding small square bars.Diamond grinding wheels and guide wheels mounted on the spindle rotate in the positive direction to grind the small square bar into small cylinders. The grinding amount is large and the efficiency is high. The biggest advantage of the square grinding (rounding) machine is that the small square bar is ground(rolled) into a cylinder at a time, and the minimum processing diameter can reach 0.8mm, which is especially suitable for fine materials. Our factory square grinding machine has semi-automatic and fully automatic two models. One worker operates one machine in semi-automatic square grinding. One worker operates a semi-automatic square grinding circle, and one worker can operate multiple fully automatic square grinding circles at the same time.
Application
Magnetic materials (NdFeB, SmCo, ferrite, niobium, etc.), optical glass, crystal, semiconductor, graphite, ceramic, silicon wafer, gemstone and other hard brittle materials
Technical Parameters
Maximum processing size (mm)Φ3square blank, Φ6 cylindrical blank
Minimum processing size (mm)Φ0.8
Grinding length range (mm)10-50
Grinding speed (min)Continuous feeding 600-800mm
Grinding accuracy (mm)Rough grinding non-roundness ±0.04, Fine grinding non-roundness ±0.03
Guide wheel table lateral stroke (mm)80
Up and down stroke of guide plate (mm)25
Main motor(AC380V x 52HZ)1.5kw ×1460r/min
Secondary motor electronic adjustment motor1.1kw × (0-1200r/min)
Dimension(mm)890 *800 *1200
Weight 400(kg)
We have many types of machines, such as ID slice machine(Inner circle slicer, inside diameter slicer, ID saw), Automatic square bar rounding grinding machine, semi-auto square grinding machine
 
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