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96% Al2O3 Alumina Aluminum Oxide Heat Dissipation Automotive Ceramic Substrate, Ceramic Substrate for Catalytic Converter, Ceramic PCB Board

Supplier SHENZHEN JINGHUI INDUSTRY LIMITED
Price $0.50 / Pieces
Availability In Stock
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Subtotal: $5

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Eligible for refunds within 30 days of receiving products. returns and refunds 

 
Model NO.
JJBP-0111-0003
Thickness Tolerance
±0.03/0.05mm (Depending on Thickness)
Length and Width Tolerance
±2mm
Transport Package
Individual Package
Specification
Max. up to 500mm x 500mm
Trademark
JingHui
Origin
China
HS Code
8547100000
Type:
Blank Ceramic Circuit Board
Forming Method:
Tape Casting
Features:
High Mechanical Strength, Small Dielectric Loss
Optional Color:
White, Ivory, Pink, Black
Density:
Over 3.70g/cm3
Standard Thickness:
0.1-2.0mm Available
96% Al2O3 Alumina Aluminum Oxide Heat Dissipation Automotive Ceramic Substrate

Product Introduction

1. 96% Alumina (Al2O3) is one of the most popular ceramic substrate materials because of its excellent heat resistance, high mechanical strengthabrasion resistance, and small dielectric loss. The surface of the alumina ceramic substrate is quite smooth and has a low porosity.


2. 96% Alumina substrates are suitable for thick film applications like hybrid PCB and component substrates or it can be used in direct plated copper sputtering.

3. Thanks to its adequate thermal conductivity, it can also be used as a heat spreader at the back of a PCB. It is also suitable for usage in high power and high-frequency applications because of dielectric properties.
 

96% Al2O3 Alumina Aluminum Oxide Heat Dissipation Automotive Ceramic Substrate
Product Parameters
 
Alumina Ceramic Substrate
ItemUnit96% Al2O3
Mechanical Properties
Color//White
DensityDrainage Methodg/cm33.70
Light Reflectivity400nm/1mm%94
Flexural StrengthThree Point BendingMPa>350
Fracture ToughnessIndentation MethodMPa·m1/23.0
Vickers HardnessLoad 4.9NGPa14
Young's ModulusStretching MethodGPa340
Water Absorption  %0
Camber/Length‰T≤0.3: 5, Others: ≤3‰
Thermal Properties
Max. Service Temperature (Non-loading)/ºC1200
CTE (Coefficient of
Thermal Expansion)
20-800ºC1×10-6/ºC7.8
Thermal Conductivity25ºCW/m·K>24
Thermal Shock Resistance800ºC10 TimesNo Crack
Specific Heat25ºCJ/kg·k750
Electrical Properties
Dielectric Constant25ºC, 1MHz/9.4
Dielectric Loss Angle25ºC, 1MHz×10-4≤3
Volume Resistivity25ºCΩ·cm1014
Dielectric StrengthDCKV/mm15

Manufacturing Capacity

Products of various specifications can be produced. The table below shows our standard thicknesses and sizes.

Alumina Ceramic Substrate
96% Al2O3
Thickness (mm)Maximum Size (mm)ShapeMolding Technique
As FiredLappedPolishedRectangularSquareRound
0.25120114.3114.3  Tape Casting
0.3120114.3114.3  Tape Casting
0.38140×190    Tape Casting
0.5140×190    Tape Casting
0.635140×190    Tape Casting
0.76130×140    Tape Casting
0.8130×140    Tape Casting
0.89130×140    Tape Casting
1280×240    Tape Casting
1.5165×210    Tape Casting
2500×500    Tape Casting
Other special thicknesses within the thickness range of 0.1-2.0mm can be achieved by lapping.

Product Recommendations

Beside bare ceramic substrates, we also manufacture metallized ceramic PCBs. Metallized ceramics is one of our advantageous products.
 
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96% Al2O3 Alumina Aluminum Oxide Heat Dissipation Automotive Ceramic Substrate
96% Al2O3 Alumina Aluminum Oxide Heat Dissipation Automotive Ceramic Substrate
96% Al2O3 Alumina Aluminum Oxide Heat Dissipation Automotive Ceramic Substrate
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